1. P-type Silicon Wafer   2. Texturization   3. Phosphorus Diffusion  
 
 
 
4. Glass Removal
5. Anti-Reflection Coating
6. Electrode Printing
 
 
   
7. Firing and Contact Forming
8. Edge Isolation
9. Testing and Classification  
 
In-Line Saw Damage Etching & Texturing
Phosphorus Diffusion
PSG Removal
AR-Coating by PECVD
Screen-Printing Front & Back side electrodes
Fast Firing Furnace
Classification, I-V Testing & Sorting

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